Apogee Bonder

With Datastream Technology
Apogee Spin Coater

The Cee® Apogee™ Temporary Bonder is fully programmable and user-friendly, offering precision temporary bonding for a wide range of wafer sizes and substrate materials

  • Substrate size range: 50-300 mm
  • Dual rigid platens heat wafer stack from both sides, minimizing thermal defects
  • Ultraflat self-leveling platens minimize total thickness variation (TTV)
  • TTV as low as 5%
  • Real-time bond data for process optimization and data exporting
  • Evacuated bond chamber eliminates voids
  • Carrier and device are separated during pre-bonding evacuation
  • Includes DataStream technology
Temporary Wafer Bonding Tool Platform Reliability
Total ThroughputEst. 8-14 WPH for ≤150-mm diameter*
Est. 4-8 WPH for 200-300-mm diameter
Qualified Wafer MaterialsSiC, GaN, GaAs, InP, sapphire, silicon, glass
System Uptime>99% over a 12-month period
Mean Time to Repair (MTTR)< 24 hours
Mean Time between Failures (MTBF; hours, cycles)>600 hours, 6,000 cycles
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