Cee® wafer debonder product line permits debonding of processed, proprietary ultrathin wafers. Development engineers can complete the final step for thin wafer processing in a confidential environment for:

  • High-temperature slide-off debonding of thinned III-V and compound semiconductor materials
  • Low-stress room temperature debonding

These precision tools are the bridge between low-stress room temperature debonding or thermal high temperature slide-off and thin wafer handling for low-volume prototype production. These tools, along with the system for thin wafer handling, can accelerate your product development cycle and improve time to market for advanced thin wafer handling technologies.

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