Cee® 300MXD Megasonic Cleaner
The Cee® 300MXD megasonic developer & cleaning system applies uniform acoustic energy to spinning substrates to resolve high-density features. This design ensures enhanced development resolution and mitigates risk to fragile device structures.
- Substrate size range: 50–300 mm
- Greatly enhances developing/cleaning of high-aspect-ratio structures
- Capable of removing particles < 0.15 µm in size
- Fully programmable and automatic
- Optimization available for post-debonding adhesive cleaning on full-thickness and thinned substrates
- Optional heated dispense for metal lift-off and metal etching applications