Temporary Wafer Bonding Equipment Suite

Cost Effective Equipment's temporary bonding equipment suite, temporary bonding materials, and process development expertise provide the complete thin wafer handling package for small- to medium-scale production.

Tool Enhancements

Coating & Baking
Temporary Wafer Bonding/Debonding Tool Suite
Total ThroughputEst. 8-14 WPH for ≤150-mm diameter*
Est. 4-8 WPH for 200-300-mm diameter
Qualified Wafer MaterialsSiC, GaN, GaAs, InP, sapphire, silicon, glass
System Uptime>99% over a 12-month period
Mean Time to Repair (MTTR)< 24 hours
Mean Time between Failures (MTBF; hours, cycles)>600 hours, 6,000 cycles

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