High Performance Wafer Processing Equipment

Cost Effective Equipment has been an industry benchmark since 1987 when we produced the world’s first semiconductor-grade benchtop bake-plate for silicon wafer processing.  In 1992 we launched another industry first with the Cee® Model 100 spin coater.  These tools established Cee® – then a part of Brewer Science Inc. as a leader in high-precision wafer process instruments for demanding applications.  Cee® spin coaters and hotplates are routinely used for photoresist and anti-reflective coatings for photolithography, e-beam resists, sol-gels, packaging adhesives, adhesion promoters, dielectrics, and SU-8 as well as photomask processing.

Over the decades since, our product line expanded to include spin-develop and spin-clean systems as well as wafer chill-plates and large-area panel processing tools.  In 2016 at the CS Mantech show we introduced a complete line of temporary wafer bonders and debonders for laboratory and small-volume production.  These tools are especially suited for compound semiconductors, wafer-thinning processes, and wafer-level packaging.

Headquartered in Saint James, Missouri USA, we work through a network of trained international distributors to supply and support your needs.