HMDS Bake Plate

A photograph of the custom Cee® Apogee® HMDS Vapor Prime process module for X-Pro II Workstation

Amplifying Adhesion: HMDS Bake Our client faced persistent issues with photoresist delamination during the photolithography process. To address this, we implemented a solution involving Hexamethyldisilazane (HMDS) priming using the Apogee® 200mm Bake Plate. This enhanced photoresist adhesion, improved yield, reduced defects, and lowered costs, ultimately streamlining project timelines. Additionally, a 75° contact angle was achieved […]

UV Cure Spin Coater

A photograph of the Cee® Apogee® UV Cure Custom Spin Coater

UV Cure Spin Coater A leading nanophotonics and nano-optic security company partnered with Cee® to develop a custom UV cure spin coater. The tool integrates UV curing with spin coating, preventing oxidation and ensuring consistent, high-quality production of nanostructured materials. Introduction In the highly specialized field of nanophotonics and nano-optic features, precision and process control […]

Large Format Spin Coater

Image of a Cee® Large Format Custom Spin Coater

Large Format Spin Coater In the realm of genetic engineering, diagnostic nanomaterials, and high-precision diagnostic equipment, precision and uniformity are paramount. When a leading company in this industry required a specialized spin coater to apply thin, uniform coatings of functionalized nanomaterials onto substrates, they turned to Cee®. This case study highlights the collaboration between Cee® […]

Mini-Spin Coater

Cee® custom mini-spin coater

Mini-Spin Coater A photovoltaic research institute required a compact spin coater to integrate with a robotic work cell. Cee® created a custom coater with a 120mm Teflon™ bowl, a mechanized lid, and auto-dispense functionality. This solution met the institute’s high-speed control needs, chemical compatibility, and space constraints. In production, the coater exceeded expectations, delivering safety […]

Megasonics

A image of the Cee® Apogee™ 450 Megasonic

The Megasonic Method A semiconductor manufacturer faced challenges cleaning intricate structures on substrates. Conventional methods were inadequate, causing defects and lower device performance. Cee® suggested using megasonic technology, utilizing high-frequency sound waves to remove contaminants effectively. We chose the ProSys Stainless Steel MegPie™ transducer for its precision and adaptability, integrated with DataStream Software for process […]