This work presents fabrication of a dielectrophoretic chip packaged at wafer level, using an imprinted SU8 bonding process between silicon and glass wafers. The source text explicitly states that SU8-5 photoresist was spun on a dummy silicon wafer using a CEE spin coater in two steps: 500 rpm for 15 s and 3,000 rpm for 60 s, producing a 12 μm SU8-5 layer. After printing the SU8 layer to the silicon wafer, wafer detachment was performed on a vacuum hot plate at 150°C using a blade, followed by alignment with a glass wafer containing inlet/outlet holes and final wafer-to-wafer bonding. This makes it a useful legacy CEE reference tied directly to a defined photoresist coating and thermal process in microfluidic device fabrication.
