Cee® Lithography Support Tools – Cornell NanoScale Facility

2 inch, 3 inch, 4 inch, 5 inch, 6 inch, 8 inch, 200 mm
Microposit EBR 10A, Unknown
Spin Coater, 200mm Spin Coater, Apogee® 200 Spin Coater, 200X (Legacy), Bake Plates, 1300X (Legacy)
Source:Cornell NanoScale Facility, Cornell University
Material: Microposit EBR 10A, Unknown
Source:Unknown
Cornell NanoScale Facility lists multiple specific Cee® lithography support tools in its open-access cleanroom, including Cee® 1300X hotplates, Cee® Apogee spinners, and a Cee® Flange Spinner Model 200 platform used for edge bead removal.
Publication Year: Unknown

Process Overview

Cornell NanoScale Facility identifies several specific Cee® platforms within its lithography support area. The equipment listing includes Cee® 1300X Hotplates, described as proximity bake hotplates for resist and other films from 90°C to 205°C, and Cee® Apogee Spinners, described as manual resist spinners that accommodate substrates from small pieces up to 200 mm wafers, with spin speeds over 6000 rpm and acceleration up to 30,000 rpm/sec. The facility also lists an Edge Bead Removal System that uses a Cee® Flange Spinner Model 200 platform and Microposit EBR 10A solvent. This makes the entry useful not only as an installed-base reference, but also as a direct example of Cee® equipment being used in a defined lithography support process within a major university nanofabrication facility.

Related Research

Tools – BioNIUM Nanofabrication Facility

Unknown
Unknown
Spin Coater, 200mm Spin Coater, 200X (Legacy)
The University of Miami BioNIUM nanofabrication facility tool listing explicitly includes a Cee® 200X Precision Spin Coater as part of its lithography-related equipment set.

Direct Photopatterning of Metal Oxide Structures Using Photosensitive Metallorganics

4 inch
MIBK
Spin Coater, 200mm Spin Coater, 100 (Legacy)
This Georgia Tech paper describes direct photopatterning of mixed-metal oxide films using a photosensitive metallorganic precursor. The precursor films were spin coated onto 100 mm single-side polished silicon wafers using a Cee® Model 100 CB Spin Coater and Bake Unit

Cee® Spin Coater & Baking Tools – University of Kansas Nanofabrication Facility

Unknown
Unknown
Spin Coater, 200mm Spin Coater, 200X (Legacy), Bake Plates, Apogee® 200 Bake Plate, 1300X (Legacy)
The University of Kansas Nanofabrication Facility lists a Cee® coat and bake workflow that includes a Cee® 200CBX Programmable Spin Coater, Cee® 1300X Hot Plate, and Cee® Apogee® Hot Plate. The page also states that the 200CBX supports multiple chuck sizes for a variety of substrate sizes.