This thesis covers microscale device development for detection of melanocytic growths in the skin. In the accessible snippet from the thesis PDF, a silicon wafer is coated with OmniCoat and SU-8 3025 photoresist, and the process explicitly references use of a CEE spin coater.
Publication Year: 2019
Process Overview
Based on the accessible thesis snippets, this work includes microfabrication steps for skin-diagnostic microscale devices using a silicon wafer substrate. One explicitly exposed process sequence states that the wafer backside was coated with OmniCoat and SU-8 3025 photoresist in preparation for creating deep bores. Another snippet explicitly names a CEE spin coater, followed by alignment under a chrome mask with 50 um circular dots and UV exposure at 160 mJ/cm2. That makes this a useful university thesis reference tying a named CEE coating step to SU-8-based device fabrication.
The University of Miami BioNIUM nanofabrication facility tool listing explicitly includes a Cee® 200X Precision Spin Coater as part of its lithography-related equipment set.
Direct Photopatterning of Metal Oxide Structures Using Photosensitive Metallorganics
4 inch
MIBK
Spin Coater, 200mm Spin Coater, 100 (Legacy)
This Georgia Tech paper describes direct photopatterning of mixed-metal oxide films using a photosensitive metallorganic precursor. The precursor films were spin coated onto 100 mm single-side polished silicon wafers using a Cee® Model 100 CB Spin Coater and Bake Unit
The University of Kansas Nanofabrication Facility lists a Cee® coat and bake workflow that includes a Cee® 200CBX Programmable Spin Coater, Cee® 1300X Hot Plate, and Cee® Apogee® Hot Plate. The page also states that the 200CBX supports multiple chuck sizes for a variety of substrate sizes.
