This study presents the fabrication of flexible near-field electronic devices for biosensing, where multiple spin-coated material layers are used to define device structure and functionality. SU-8 negative photoresist is spin coated to form structural and dielectric features, while AZ3310 positive photoresist is spin coated for photolithographic patterning of device geometries.
These coating steps are performed using Cee® 200X-F and Apogee® spin coating systems, enabling controlled deposition of both thick and thin resist films on flexible substrates. Following coating, the materials undergo standard exposure, development, and thermal processing to establish high-resolution features and stable device architectures.
The integration of SU-8 and AZ3310 within the process flow highlights the need for consistent coating performance across different resist chemistries and film thicknesses, particularly when working with non-rigid substrates where uniformity and repeatability directly influence device performance.
