This Washington University Micronanofabrication Facility page outlines lithography capabilities, explicitly including Cee® Spin Coaters for photoresist coating and Cee® Hot Plates for bake processing steps. These tools support standard lithography workflows, where photoresist is applied to substrates and thermally processed prior to exposure and development.
While the page does not provide detailed process parameters, it clearly ties both coating and bake steps to Cee® equipment, reinforcing their role in integrated lithography processing within a university cleanroom setting. This makes it a strong facility-level reference showing both spin coating and thermal processing capabilities using Cee® platforms.
