Automated Dispense Systems
This article explores automated dispense options for spin coating applications in the semiconductor industry including cartridge dispense, pressure can dispense, and disposable syringe dispense. The article also touches on dispense controls, edge bead removal, and backside rinse, while highlighting the benefits of the Cee® line-up of Apogee® Spin Coaters. Automated Dispense Systems Spin coating is […]
Nitrogen Purge
Nitrogen purge is widely employed in the manufacturing of semiconductors. It is utilized to establish a low-oxygen setting for processing substrates. This method helps remove impurities, minimize oxidation, maintain uniform film deposition, and can be beneficial for meeting safety standards. Nitrogen Purge Nitrogen purge is a common technique used in various industries, including semiconductor manufacturing, […]
Multi-Stage Baking with Programmable Lift Pins
Smart-Pin technology enables flexible temperature ramping and uniform baking for thermal shock sensitive materials. The lift pin height recipe utilizes a temperature matrix for soft bake, PEB, and post-develop hard bake. The programmable system eliminates the need for multiple bake plates and is suitable for thick-film materials and mitigating the “skin” effect. Multi-Stage Baking with […]
Spin Chucks for Square Substrates
Spin-coating is a process used to evenly distribute material on a substrate by spinning it at a high speed. Round substrates are commonly used because their smooth edges create minimal turbulence, resulting in uniform evaporation rates. However, square and rectangular substrates create unique challenges due to increased air turbulence and can result in uneven coating […]
Spin Chucks for Thinned Substrates
Thinner and delicate substrates are commonly used in the semiconductor industry, and their safe handling requires special techniques and spin chucks. These substrates can be made of various materials, including silicon, metal foils, and flexible polymer films, and are highly sensitive to mechanical and thermal shock. Thin Wafer Processing Trends Thin and fragile substrates are […]
Programmable Exhaust for Optimal Thick-Film Spin Coating
For ultra-high uniformity on thick films in spin-coating processes, precise control of solvent vapors is crucial. This is achieved through a closed bowl environment and a programmable exhaust module. The process involves a prewet dispense step, dynamic dispense step, and drying step to create a highly uniform coating. Spin speed, acceleration, and drying rate are […]