Flexible debonding to meet your changing needs.
Cee® 1300CSX Thermal Slide Debonder
New device requirements have rendered traditional debonding methods obsolete. Chemical baths and manual debonding are unreliable and time-consuming, leading to inconsistent results and lost productivity.
The Cee® 1300CSX Debonder is a new generation of debonding tool offering precise, efficient, and flexible thermal slide debonding for demanding applications in the compound and thin-film semiconductor industries.
The Temporary Bonding & Debonding Process Flow
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The Cee® 1300CSX Thermal Slide Debonder is a production fab ready, semi-automated tool. It uses dual heated platens to soften adhesives or waxes in a bonded wafer pair to their melting point and then applies precisely controlled forces to slide the carrier and device wafers apart. Temperatures, positions, forces and speeds are recipe controlled with full logging of each wafer process.
These tools are primarily used for small volume compound semiconductor and thinned silicon production fabs where precise control is required to maintain yields and device performance. Because the 1300CSX does not use robots to load and unload wafers, footprint and cost is dramatically reduced, and flexibility to work with multiple wafer sizes is enhanced.