Apogee™ Mechanical DebonderWith DataStream™ Technology
The Cee® Apogee™ Mechanical Debonder offers a low-stress, room temperature solution to wafer separation on film frame.
- Permits debonding of ultrathin device wafers
- Debonds on film frame – no thin wafer handling
- Includes DataStream™ technology
- Low mechanical stress and no thermal stress
- Substrate size range: 100–300 mm
- < 1 minute full cycle time