Apogee Mechanical Debonder

With Datastream Technology Technology
Apogee Debonder

The Cee® Apogee™ Mechanical Debonder offers a low-stress, room temperature solution to wafer separation on film frame.

Debonding Tool Platform Reliability
Total ThroughputUp to 20 WPH
Yield> 98%
Wafer Size50 mm to 300 mm
Operating TemperatureRoom Temperature

Benefits

  • Permits debonding of ultrathin device wafers
  • Debonds on film frame – no thin wafer handling
  • Powered by Datastream Technology
  • Low mechanical stress and no thermal stress
  • Substrate size range: 100–300 mm
  • Semi-automated
  • < 1 minute full cycle time

Dimensions

  • 635 mm (25") W x 914 mm (36") D x 1842 mm (72.5") H
  • Machine Weight: 156 kg (337lbs)
  • Shipping Weight: 300 kg (661lbs)

Utilities

  • Voltage: 90-264 V AC; 50/60Hz
  • Power: 365 Watts
  • Vacuum: <35 kPa (>20 in Hg)
  • N2 or CDA: 0.35 kPa (55psi)

Other Specifications

  • Substrate sizes (round): 50 mm to 300mm
  • Force range: 0 to 100 N (1 to 22 lbs)
  • Excess force sensing: failsafe error recovery
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