Whether it’s the device or the adhesive, heat is the enemy, and mechanical debonding at room temperature is the solution.
Unlike DIY methods or hand tools, the Apogee® Mechanical Debonder delivers consistent, controlled separation. All mechanical force is directed to the carrier wafer while the device wafer is safely supported on your film frame. That means zero fear of cracks, chips, or yield loss. Precision you can trust…
…no razor blades required.
From R&D labs to production fabs around the world, the Apogee® Mechanical Debonder has been tried, tested, and trusted to deliver. With a semi-automated process built for precision, it ensures consistent, repeatable results across devices, operators, and runs so you can process with confidence every time.
Multiple wafer sizes shouldn’t require multiple tools. The Apogee® Mechanical Debonder easily transitions with quick-change fixtures supporting everything from small substrate R&D to full-scale 300 mm production.
Adapt fast. Keep lines moving. Future-proof your process.
High-volume debonding doesn’t have to mean high-cost automation. The Apogee® Mechanical Debonder offers a smart way to scale without locking into expensive robotics. With a compact footprint, semi-automated workflow, and fast cycle times, one person can run multiple systems in parallel. Grow production at your pace without pre-paying for complexity you don’t need.
Engineered for superior performance, usability, versatility – and peace of mind.
Front-access load station allows quick loading of bonded wafer pairs on film frames. After debonding, the system presents both wafers back to the operator for easy retrieval.
On-board 10-inch color touchscreen with DataStream™ OS included for visibility and your ease-of-use.
Floor standing design fits seamlessly into tight spaces. Integrated storage keeps components organized and within reach.
Swap fixtures in under 3 minutes to accommodate different carrier and film frame sizes to keep workflows fast and flexible.
Ultra-flat, porous ceramic chuck provides uniform vacuum across film frames and thin device wafers, securing fragile substrates without damage or distortion.
NRTL certification is crucial for semiconductor equipment, ensuring compliance with safety standards set by regulatory bodies like OSHA and ANSI.
Cee® bonders and debonders are NRTL listed right out of the box…
…your safety department is going to love you.
Knowledge is power. With DataStream™ technology, monitor and manage in real time, ensuring production-quality results from anywhere. Proactive warnings and detailed log files give you the information you need to succeed.
Process parameters and measurements are logged in real-time. Export in multiple formats for analysis, troubleshooting, and process optimization.
Access your Apogee® Mechanical Debonder remotely via any web browser for real-time monitoring, adjustments, and recipe management. Create, modify, upload, download, and archive recipes seamlessly.
300mm Round
50mm Round
0-75N
Room Temperature
1N
10″ Full Color Touchscreen (included)
Unlimited / Unlimited
0.1 s
337 lb (152.9kg)
540 lb (245kg)
W: 24″ (610mm)
D: 33.5″ (851mm)
H: 73.25″ (1861mm)
W: 48″ (1220mm)
D: 32″ (813mm)
H: 77″ (1956mm)
100-120 or 208-230 VAC
1/4″ Push to Connect, 70psi, 0.02cfm
9.5A (max)
1/4″ Push to Connect, <20″ Hg,0.7cfm
(33kPa, 20 l/min)
W: 13.25″ (337mm) W
D: 21″ (533mm) D
H: 13.25″ (337mm) H
With four decades of experience, our experts will collaborate closely with you to understand your requirements and deliver solutions that exceed expectations.
