Apogee Mechanical Debonder

With DataStream Technology
Apogee Debonder

The Cee® Apogee™ Mechanical Debonder offers a low-stress, room temperature solution to wafer separation on film frame.

  • Permits debonding of ultrathin device wafers
  • Debonds on film frame – no thin wafer handling
  • Includes DataStream™ technology
  • Low mechanical stress and no thermal stress
  • Substrate size range: 100–300 mm
  • Semi-automated
  • < 1 minute full cycle time
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