The Cee® Apogee™ Mechanical Debonder offers a low-stress, room temperature solution to wafer separation on film frame.

Benefits

• Permits debonding of ultrathin device wafers
• Debonds on film frame – no thin wafer handling
• Includes DataStream™ technology
• Low mechanical stress and no thermal stress
• Substrate size range: 100–300 mm
• Semi-automated
• < 1 minute full cycle time