Apogee™ Mechanical Debonder
With Datastream™ Technology Technology
The Cee® Apogee™ Mechanical Debonder offers a low-stress, room temperature solution to wafer separation on film frame.
| Debonding Tool Platform Reliability | |
|---|---|
| Total Throughput | Up to 20 WPH |
| Yield | > 98% |
| Wafer Size | 50 mm to 300 mm |
| Operating Temperature | Room Temperature |
Benefits
- Permits debonding of ultrathin device wafers
- Debonds on film frame – no thin wafer handling
- Powered by Datastream™ Technology
- Low mechanical stress and no thermal stress
- Substrate size range: 100–300 mm
- Semi-automated
- < 1 minute full cycle time
Dimensions
- 635 mm (25") W x 914 mm (36") D x 1842 mm (72.5") H
- Machine Weight: 156 kg (337lbs)
- Shipping Weight: 300 kg (661lbs)
Utilities
- Voltage: 90-264 V AC; 50/60Hz
- Power: 365 Watts
- Vacuum: <35 kPa (>20 in Hg)
- N2 or CDA: 0.35 kPa (55psi)
Other Specifications
- Substrate sizes (round): 50 mm to 300mm
- Force range: 0 to 100 N (1 to 22 lbs)
- Excess force sensing: failsafe error recovery