The Art of Manual Dispense
While automated solutions offer convenience and consistency, manual dispense for spin coating remains an invaluable technique, providing precise control and unmatched flexibility. In this article, we’ll discuss the benefits of manual dispensing for spin-coating semiconductor substrates, offering insights, tips, and best practices for this approach. Spin Coating Basics Spin coating is a widely used technique […]
NRTL! What is it good for?
NRTL certification is becoming crucial for semiconductor equipment manufacturers as it ensures compliance with safety standards set by regulatory bodies like OSHA and ANSI. It also facilitates market access, instills customer confidence, provides liability protection, and encourages continuous improvement in safety and quality practices. For custom equipment, additional evaluations may be required. In years to […]
Automated Dispense Systems
This article explores automated dispense options for spin coating applications in the semiconductor industry including cartridge dispense, pressure can dispense, and disposable syringe dispense. The article also touches on dispense controls, edge bead removal, and backside rinse, while highlighting the benefits of the Cee® line-up of Apogee® Spin Coaters. Automated Dispense Systems Spin coating is […]
Nitrogen Purge
Nitrogen purge is widely employed in the manufacturing of semiconductors. It is utilized to establish a low-oxygen setting for processing substrates. This method helps remove impurities, minimize oxidation, maintain uniform film deposition, and can be beneficial for meeting safety standards. Nitrogen Purge Nitrogen purge is a common technique used in various industries, including semiconductor manufacturing, […]
The Cotton Candy Effect
The cotton candy effect is a common issue in the semiconductor manufacturing process where dried material comes off the substrate in string-like filaments instead of droplets. To address this issue, process parameters and environmental factors should be adjusted. Optimization testing is required to fine-tune the process until the cotton candy effect is eliminated. The Cotton […]
Spin Chucks for Square Substrates
Spin-coating is a process used to evenly distribute material on a substrate by spinning it at a high speed. Round substrates are commonly used because their smooth edges create minimal turbulence, resulting in uniform evaporation rates. However, square and rectangular substrates create unique challenges due to increased air turbulence and can result in uneven coating […]
Spin Chucks for Thinned Substrates
Thinner and delicate substrates are commonly used in the semiconductor industry, and their safe handling requires special techniques and spin chucks. These substrates can be made of various materials, including silicon, metal foils, and flexible polymer films, and are highly sensitive to mechanical and thermal shock. Thin Wafer Processing Trends Thin and fragile substrates are […]
Selecting Maximum Spin Speed and Acceleration
In spin coating, the speed and acceleration of a spinning substrate affect the thickness and quality of a film. The substrate’s rotational speed affects the centrifugal force and air turbulence, while its acceleration affects the film’s properties. The initial spin cycle is critical because the resin dries quickly, and up to 50% of base solvents […]
Programmable Exhaust for Optimal Thick-Film Spin Coating
For ultra-high uniformity on thick films in spin-coating processes, precise control of solvent vapors is crucial. This is achieved through a closed bowl environment and a programmable exhaust module. The process involves a prewet dispense step, dynamic dispense step, and drying step to create a highly uniform coating. Spin speed, acceleration, and drying rate are […]
Spin Coat Theory
Spin coating is a process used to apply thin films onto a substrate, typically involving depositing a small puddle of a fluid material on the center of the substrate and spinning it at high speed. The final thickness of the film depends on the properties of the fluid and the spin process parameters. The speed […]