Automated Dispense Systems
This article explores automated dispense options for spin coating applications in the semiconductor industry including cartridge dispense, pressure can dispense, and disposable syringe dispense. The article also touches on dispense controls, edge bead removal, and backside rinse, while highlighting the benefits of the Cee® line-up of Apogee® Spin Coaters. Automated Dispense Systems Spin coating is […]
Nitrogen Purge
Nitrogen purge is widely employed in the manufacturing of semiconductors. It is utilized to establish a low-oxygen setting for processing substrates. This method helps remove impurities, minimize oxidation, maintain uniform film deposition, and can be beneficial for meeting safety standards. Nitrogen Purge Nitrogen purge is a common technique used in various industries, including semiconductor manufacturing, […]
Developer Configurations
The use of immersion tank processes in photolithography has decreased due to excessive material consumption, non-uniform resolution, and poor clearing from high-aspect-ratio features. Spin developing has become the more popular method for development of features in photolithography, with three main methods emerging: puddle/stream dispense, side spray dispense, and direct spray dispense. The side spray dispense […]
Selecting Maximum Spin Speed and Acceleration
In spin coating, the speed and acceleration of a spinning substrate affect the thickness and quality of a film. The substrate’s rotational speed affects the centrifugal force and air turbulence, while its acceleration affects the film’s properties. The initial spin cycle is critical because the resin dries quickly, and up to 50% of base solvents […]
Spin Coat Theory
Spin coating is a process used to apply thin films onto a substrate, typically involving depositing a small puddle of a fluid material on the center of the substrate and spinning it at high speed. The final thickness of the film depends on the properties of the fluid and the spin process parameters. The speed […]
Edge Bead Removal and Backside Rinse Demystified
Edge bead removal is used to eliminate build up while backside rinse prevents contamination. Using an automated system for both processes results in precise, efficient, and consistent results with minimal operator intervention. Introduction Edge bead removal (EBR) and back-side rinse (BSR) are critical processes in the fabrication of high-quality micro and nanoscale devices such as […]