The use of immersion tank processes in photolithography has decreased due to excessive material consumption, non-uniform resolution, and poor clearing from high-aspect-ratio features. Spin developing
Smart-Pin technology enables flexible temperature ramping and uniform baking for thermal shock sensitive materials. The lift pin height recipe utilizes a temperature matrix for soft
Spin-coating is a process used to evenly distribute material on a substrate by spinning it at a high speed. Round substrates are commonly used because
Thinner and delicate substrates are commonly used in the semiconductor industry, and their safe handling requires special techniques and spin chucks. These substrates can be
In spin coating, the speed and acceleration of a spinning substrate affect the thickness and quality of a film. The substrate’s rotational speed affects the
For ultra-high uniformity on thick films in spin-coating processes, precise control of solvent vapors is crucial. This is achieved through a closed bowl environment and
Spin coating is a process used to apply thin films onto a substrate, typically involving depositing a small puddle of a fluid material on the
Edge bead removal is used to eliminate build up while backside rinse prevents contamination. Using an automated system for both processes results in precise, efficient,
At Cee® we keep the spam in the can.
No filler just updates on the products, services, and resources you know and trust.
© Copyright 2023 - Cost Effective Equipment, LLC
Cee® is a registered trademark of Cost Effective Equipment, LLC.
