Bake

Cost Effective Equipment has been an industry benchmark since 1987 when we produced the world’s first semiconductor-grade benchtop bake plate for silicon wafer processing. In 1992 we launched another industry first with the Cee® Model 100 spin coater.

In the decades since, our product line has expanded to include spin-develop and spin-clean systems as well as wafer chill-plates, large area panel processing tools, and a complete line of temporary wafer bonders and debonders for laboratory and small volume production.

Headquartered in Saint James, Missouri USA, we're pleased to work through a network of trained international distributors to supply and support your needs.