Research Using Cee® Equipment - Cost Effective Equipment

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Research Using Cee® Equipment

Real Research. Real Labs. Proven Performance.

Cee® wafer processing equipment has supported university, nanofabrication, and advanced materials research since 1987. Originating as a division of Brewer Science, these systems were developed to meet demanding internal semiconductor process requirements where commercially available equipment fell short.

Today, Cee® equipment—including spin coaters, bake plates, developers, and bonding systems—continues to support a wide range of research and process applications. This reference library documents published research, university facilities, and real-world use of Cee® equipment across these environments.

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Off-Stoichiometry Thiol–Ene Polymers: Inclusion of Anchor Groups Using Allylsilanes

Spin Coater
Bio, Microfluidics
Materials: OSTE-AS Polymer

This paper develops OSTE-AS polymers for bonding and integration with silicon wafers and explicitly states that the OSTE-AS prepolymers were deposited on silicon wafers using a Cee® Apogee® Spin Coater module of an X-Pro II Workstation. The paper also reports 100 mm silicon wafers and gives resulting film thicknesses of 12.9 µm, 4.9 µm, and 3.4 µm at 1000, 3000, and 5000 rpm, respectively.

Omnidirectional Circularly Polarized Thermal Radiation Enabled by Chiral Metasurface

Bake Plate, Spin Coater
Sensor
Materials: Photoresist, PMMA

This paper describes fabrication of a chiral metasurface for circularly polarized thermal radiation and includes use of a Cee® Apogee® Spin Coater and Cee® Apogee® Bake Plate in the sample preparation flow, including spin coating of PMMA 950 K A4.

Microfluidic Bioelectrochemical Cell Platform for the Study of Extracellular Electron Uptake in Microbes

Spin Coater
Materials: AZ4620, HMDS, LOR10B, PDMS, Photoresist, S1805, SU-8

This preprint describes fabrication of a glass-based microfluidic bioelectrochemical cell platform and explicitly states that KL8020 HMDS Spin-On Primer was spin coated on 100 mm borosilicate glass wafers using an Apogee® Spin Coater. The broader lithography flow also includes spin-coated LOR 10B, Microposit™ S1805™, AZ P4620, and SU-8 2100.

Design and Fabrication of an Electronic Skin Sensor and Sensor Array for Contact Pressure Monitoring during Colonoscopy

Spin Coater
Bio Sensing Devices
Materials: AZ10XT

This thesis describes fabrication of a flexible electronic skin sensor and sensor array for colonoscopy pressure monitoring and explicitly shows AZ 10XT photoresist being applied to a silicon wafer mounted in an Apogee® Spin Coater during the electrode preparation process.

Temporary Wafer Bonding Materials with Mechanical and Laser Debonding Technologies for Semiconductor Device Processing

Debonder
Temporary Bonding & Debonding
Materials: BrewerBond

This paper evaluates temporary wafer bonding materials for semiconductor processing and shows compatibility with both mechanical and laser debonding approaches. In the mechanical release flow, bonded wafer pairs were separated using a Cee® Apogee® Mechanical Debonder.

Fast Switching Liquid Crystal Materials: From Design to Biomedical Application

Spin Coater
Bio
Materials: Nissan Chemicals ER-1744, Polyimide

This dissertation describes liquid crystal cell preparation for advanced optical and biomedical applications and explicitly states that Nissan Chemicals ER-1744 polyimide was spin coated onto ITO-coated soda-lime glass using an Apogee® Spin Coater. A three-step spin recipe is also provided for the polyimide coating process.

International Electric Propulsion Conference

Spin Coater
Microfabrication
Materials: SU-8

This conference paper describes fabrication of porous-glass electrospray thrusters and explicitly states that SU-8 2005 was spun using a Cee® Apogee® manual spin coater.

The Role of Time in the Structural Ordering of Poly-3-Hexylthiophene

Spin Coater
Material Science
Materials: rr-P3HT dissolved in chloroform

This paper studies annealing-time effects in P3HT thin films and explicitly states that a P3HT–chloroform solution was spin-deposited on glass substrates using an Apogee® Spin Coater.

Lithography – The Advanced Science Research Center Nanofabrication Facility

Bake Plate, Spin Coater
Lithography, Nanofabrication, Open Facitlity
Materials: E-beam, Photoresist

The CUNY ASRC Nanofabrication Facility lithography page lists multiple Cee® coating systems, including a Cee® Stand-Alone Spin Coater / hotplate for electron beam resists and two additional Cee® Spin Coaters for photoresist processing and other non-standard materials.

Tools – BioNIUM Nanofabrication Facility

Spin Coater
Lithography, Nanofabrication, Open Facitlity
Materials: Unknown

The University of Miami BioNIUM nanofabrication facility tool listing explicitly includes a Cee® 200X Precision Spin Coater as part of its lithography-related equipment set.

Direct Photopatterning of Metal Oxide Structures Using Photosensitive Metallorganics

Spin Coater
Lithography
Materials: MIBK

This Georgia Tech paper describes direct photopatterning of mixed-metal oxide films using a photosensitive metallorganic precursor. The precursor films were spin coated onto 100 mm single-side polished silicon wafers using a Cee® Model 100 CB Spin Coater and Bake Unit

Cee® Spin Coater & Baking Tools – University of Kansas Nanofabrication Facility

Bake Plate, Spin Coater
Nanofabrication, Open Facitlity
Materials: Unknown

The University of Kansas Nanofabrication Facility lists a Cee® coat and bake workflow that includes a Cee® 200CBX Programmable Spin Coater, Cee® 1300X Hot Plate, and Cee® Apogee® Hot Plate. The page also states that the 200CBX supports multiple chuck sizes for a variety of substrate sizes.

Cee® Lithography Tools – Lurie Nanofabrication Facility

Spin Coater
Lithography, Nanofabrication, Open Facitlity
Materials: AZ12XT, AZ726, KMPR, LOR10B, Photoresist, S1813, SPR220, SPR995, Unknown

The University of Michigan Lurie Nanofabrication Facility equipment directory lists multiple Cee® lithography tools, including coating, developing, and Apogee® spin coating platforms within the facility’s lithography area.

New Equipment at CNF – Cee® Model 100 Spin Coaters

Spin Coater
Open Facitlity
Materials: Unknown

This Cornell NanoScale Facility newsletter identifies two bench-top mounted Cee® Model 100 Spin Coaters used for resist coating of wafers, with support for substrates up to 200 mm round or 6-inch square.

Fundamentals of microfluidics fabrication process and the basic process flow of fabrication

Spin Coater
Microfluidics
Materials: Acetone, AZ4620, DI Water, IPA

This Washington University report references use of AZ4620 photoresist coated onto the wafer using a Cee® 200X Spin Coater as part of the microfluidics fabrication process.

Spin Coating – University of Kentucky CeNSE

Spin Coater
Materials: Photoresist

The University of Kentucky CeNSE spin coating page explicitly references the Cee® Model 100 and 150 and describes them as part of the facility’s spin coating capability for thin-film application.

Cee® Automatic Developer – Texas A&M AggieFab

Spin Developer
Nanofabrication, Open Facitlity
Materials: AZ400K, Developer, DI Water, IPA, MIF300, MIF319, SU-8 Developer

Texas A&M AggieFab lists a Cee® Automatic Developer used for photoresist development following exposure, supporting lithography workflows in a university cleanroom.

Nanofabrication Equipment & Instrumentation – Penn Nano

Spin Coater
Open Facitlity
Materials: Unknown

The Penn Nano equipment page includes imagery of a Cee® 200X Spin Coater within its spinner and solvent processing area, indicating active use of Cee® coating equipment in the facility.

PDMS Spin Coater – University of Kansas Nanofabrication Facility

Spin Coater
Open Facitlity
Materials: PDMS

The University of Kansas Nanofabrication Facility lists a Cee® Spin Coater dedicated to PDMS coating, supporting soft lithography and polymer-based device fabrication processes.

Lithography Equipment – Washington University in St. Louis Micronanofabrication Facility

Spin Coater
Lithography, Nanofabrication, Open Facitlity
Materials: Unknown

Washington University’s Micronanofabrication Facility lists Cee® Spin Coaters as part of its lithography equipment, supporting photoresist coating and bake processes in an academic cleanroom environment.

Cee® 100 Spin Coater – Utah Nanofab Wiki

Spin Coater
Lithography, Nanofabrication, Open Facitlity
Materials: Photoresist

The University of Utah Nanofab wiki lists a Cee® 100 Spin Coater used for photoresist coating in lithography processes within a shared cleanroom environment.

Cee® Apogee® Spin Coater – Penn Nano Wiki

Spin Coater
Nanofabrication, Open Facitlity
Materials: Photoresist

The Penn Nano Wiki lists a Cee® Apogee® Spin Coater used for photoresist coating in lithography processes, supporting substrates up to 6-inch wafers within a shared nanofabrication environment.

Spin Coating – University of Houston NanoFabrication Facility

Spin Coater
Open Facitlity
Materials: Photoresist

The University of Houston NanoFabrication Facility lists a Cee® Spin Coater for thin film and photoresist coating, supporting a range of lithography and polymer deposition processes within an open-access cleanroom environment.

Cee® Spin Coater #1 and #2 – ASU NanoFab

Bake Plate, Spin Coater
Lithography, Nanofabrication, Open Facitlity
Materials: Photoresist

ASU NanoFab lists Cee® Spin Coater #1 and #2 as photoresist coating systems in its cleanroom. The page explicitly identifies Cee® Spin Coater #1 as having a programmable precision hot plate bake, Cee® Spin Coater #2 as a stand-alone Spin Coater, and names the Cee® 200CBX precision coat-bake system as the integrated platform.

What This Page Represents

This page documents real-world use of Cee® equipment in research and development environments.

Each reference below represents:

Published research
University lab installations
Documented wafer processing applications

These are verifiable use cases, not marketing claims.

*Where process details are not specified in the original source, entries are labeled accordingly to maintain accuracy.