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Research Using Cee® Equipment

Real Research. Real Labs. Proven Performance.

Cee® wafer processing equipment has supported university, nanofabrication, and advanced materials research since 1987. Originating as a division of Brewer Science, these systems were developed to meet demanding internal semiconductor process requirements where commercially available equipment fell short.

Today, Cee® equipment—including spin coaters, bake plates, developers, and bonding systems—continues to support a wide range of research and process applications. This reference library documents published research, university facilities, and real-world use of Cee® equipment across these environments.

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Cee® Apogee® Spin Coater – LNF Wiki

The University of Michigan LNF Wiki lists a Cee® Apogee® Spin Coater as a fully programmable, manual-dispense photoresist coating system that accepts pieces, 4-inch wafers, and 6-inch wafers.
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Cee® 200X Photoresist Spinner 1 – LNF Wiki

  • Spin Coater
  • Nanofabrication, Open Facitlity
  • Materials: AZ12XT, SPR220
The University of Michigan LNF Wiki lists a Cee® 200X photoresist spinner as a fully programmable, automatic-dispense coating system with support for 4-inch and 6-inch wafers as well as pieces up to 2 inches.
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Design of microscale devices for the detection of melanocytic growths in the skin

This thesis covers microscale device development for detection of melanocytic growths in the skin. In the accessible snippet from the thesis PDF, a silicon wafer is coated with OmniCoat and SU-8 3025 photoresist, and the process explicitly references use of a CEE spin coater.
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Optical Sensors for High Sensitivity Motion Detection

This thesis presents fabrication of an optical MOEMS seismic sensor using double-sided DRIE on an SOI wafer. The process explicitly uses AZ 9260 positive photoresist on a CEE Spin Coater, along with HMDS priming and hot plate bake steps, tying Cee® coating equipment directly to university device fabrication.
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A dielectrophoretic chip packaged at wafer level

  • Spin Coater
  • Advanced Packaging
  • Materials: SU-8
This publication describes a wafer-level bonding process for a dielectrophoretic microfluidic chip. The exposed source text explicitly states that SU8-5 photoresist was spun on a dummy silicon wafer using a CEE spin coater in a two-step recipe, followed by detachment on a vacuum hot plate at 150°C before alignment and bonding.
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DNA origami directed nanometer-scale integration of colloidal quantum emitters with silicon photonics

This preprint presents a method for integrating colloidal quantum emitters with silicon photonic structures using lithographically defined resist cavities. The accessible full-text snippets explicitly identify AZ-nLOF 2020 coated on a Cee® Apogee Spin Coater at 2000 rpm for 60 s, with PMMA also referenced in the process flow.
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Cee® 200X and 200X-F Spin Coaters – MIT Fabtools Listing

  • Spin Coater
  • Nanofabrication, Open Facitlity
  • Materials: Unknown
MIT’s Fabtools listing explicitly references Cee® 200X-F and Cee® 200X spin coaters within its shared nanofabrication tool set. The indexed listing associates these systems with Spinner-EBL, Spinner-Polymer, and Photo / Coat usage categories.
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Cee® Apogee Spin Coater – Washington Nanofabrication Facility

  • Spin Coater
  • Nanofabrication, Open Facitlity
  • Materials: Unknown
The Washington Nanofabrication Facility tool list explicitly includes a Cee® Apogee Spin Coater within its Lithography and Direct Patterning area.
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Cee® Lithography Tools – Utah Nanofab

Utah Nanofab lists multiple specific Cee® tools across its cleanroom lithography workflow, including legacy Cee® 100 and 200X-series spinners, a Cee® 200XD develop spinner, and current-generation Apogee® spin coat and bake capability. The site also explicitly lists supported resist materials used within its photolithography process set.
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Microfluidic Bioelectrochemical Cell Platform for the Study of Extracellular Electron Uptake in Microbes

This preprint describes a glass-based microfluidic bioelectrochemical cell platform for studying extracellular electron uptake in microbes. The fabrication flow explicitly references an Apogee® Spin Coater for coating KL8020 HMDS Spin-On Primer, and the process also includes spin-coated LOR 10B, Microposit™ S1805™, AZ P4620, and SU-8 2100 within the device fabrication sequence.
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Cee® Lithography Support Tools – Cornell NanoScale Facility

Cornell NanoScale Facility lists multiple specific Cee® lithography support tools in its open-access cleanroom, including Cee® 1300X hotplates, Cee® Apogee spinners, and a Cee® Flange Spinner Model 200 platform used for edge bead removal.
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Neuromorphic Computing of SiC Based Memristor

  • Bake Plate, Spin Coater
  • Material Science
  • Materials: AZ2070, S1813
This doctoral thesis investigates SiC-based memristors for neuromorphic computing. Within the fabrication flow, the photolithography process explicitly includes S1813 positive photoresist, AZ2070 negative resist, silicon wafers, and a Cee™ Apogee Spin Coater and Bake Plate module for the resist spin/bake step.
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Cee® Spin Coating and Bake Systems – KU Nanofabrication Facility

  • Bake Plate, Spin Coater
  • Nanofabrication, Open Facitlity
  • Materials: Unknown
The KU Nanofabrication Facility provides Cee® spin coating and bake systems as part of its shared cleanroom infrastructure for lithography and thin-film processing.
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Cee® Apogee® Lithography Workflow – AggieFab Nanofabrication Facility

The AggieFab facility at Texas A&M utilizes a complete Cee® lithography workflow, including spin coating, bake, and develop systems, to support a wide range of thin-film and photolithographic processes in a shared research environment.
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Flexible Near-Field Electronics for High-Resolution Biosensing

This work demonstrates fabrication of flexible near-field electronic biosensors using spin-coated SU-8 and AZ3310 photoresists. The study explicitly references Cee® 200X-F and Apogee® systems for these coating steps.
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Sub-1% Coating Uniformity on 300 mm Wafers Sub-1% Coating Uniformity on 300 mm Wafers Using Apogee™ Spin Coater

  • Spin Coater
  • Lithography
  • Materials: SU-8
A series of controlled experiments were performed to achieve sub-1% total thickness variation across 300 mm silicon wafers using a Cee® 300X (Apogee™) spin coater platform. Multiple process variables were evaluated, including dispense method (static vs dynamic), ramp-to-spin rates, exhaust control, pre-wet conditions, and spread spin behavior. The results identified exhaust control and ramp-to-spin as the most significant contributors to coating uniformity.
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What This Page Represents

This page documents real-world use of Cee® equipment in research and development environments.

Each reference below represents:

  • Published research
  • University lab installations
  • Documented wafer processing applications

These are verifiable use cases, not marketing claims.

*Where process details are not specified in the original source, entries are labeled accordingly to maintain accuracy.