Cee® Lithography Support Tools – Cornell NanoScale Facility

Bake Plate, Spin Coater
Edge Bead Removal (EBR), Nanofabrication, Open Facitlity
Materials: Microposit EBR 10A, Unknown

Cornell NanoScale Facility, Cornell University

Apogee® 200 Spin Coater, Cee® 1300X (Legacy), Cee® 200X (Legacy)

Wafer Size: 100mm, 125mm, 150mm, 200mm, 50mm, 75mm, Not Specified

Substrate Type: Not Specified

Cornell NanoScale Facility lists multiple specific Cee® lithography support tools in its open-access cleanroom, including Cee® 1300X hotplates, Cee® Apogee spinners, and a Cee® Flange Spinner Model 200 platform used for edge bead removal.

Publication Year: Unknown

Process Overview

Cornell NanoScale Facility identifies several specific Cee® platforms within its lithography support area. The equipment listing includes Cee® 1300X Hotplates, described as proximity bake hotplates for resist and other films from 90°C to 205°C, and Cee® Apogee Spinners, described as manual resist spinners that accommodate substrates from small pieces up to 200 mm wafers, with spin speeds over 6000 rpm and acceleration up to 30,000 rpm/sec. The facility also lists an Edge Bead Removal System that uses a Cee® Flange Spinner Model 200 platform and Microposit EBR 10A solvent. This makes the entry useful not only as an installed-base reference, but also as a direct example of Cee® equipment being used in a defined lithography support process within a major university nanofabrication facility.

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