Cee® Apogee® Lithography Workflow – AggieFab Nanofabrication Facility

Bake Plate, Spin Coater, Spin Developer
Lithography, Nanofabrication, Open Facitlity
Materials: Photoresist, PMMA, Polyimide, SU-8

AggieFab (Texas A&M University)

Apogee® 200 Bake Plate, Apogee® 200 Spin Coater, Apogee® 200 Spin Developer

Wafer Size: 150mm

Substrate Type: Not Specified

The AggieFab facility at Texas A&M utilizes a complete Cee® lithography workflow, including spin coating, bake, and develop systems, to support a wide range of thin-film and photolithographic processes in a shared research environment.

Publication Year: 2025

Process Overview

The AggieFab nanofabrication facility incorporates a full Cee® lithography workflow, integrating spin coating, thermal processing, and development within a shared cleanroom environment. Spin coating systems are used to apply SU-8 for structural layers, AZ-series photoresists such as AZ3310 and S18xx for photolithographic patterning, polyimide for insulating films, and PMMA for electron-beam lithography processes. Following coating, substrates are transferred to Cee® bake plates for controlled soft bake and post-exposure bake steps, and then processed through Cee® developer systems to define patterned features. This sequence enables consistent film formation and reliable pattern transfer across a range of materials and applications. The use of an integrated coating, bake, and develop toolset supports repeatable processing in a multi-user environment, where maintaining consistency across different materials and workflows is essential.

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