Fundamentals of microfluidics fabrication process and the basic process flow of fabrication

Washington University in St. Louis, MEMS 500 Independent Study report by X. Jiang.
Cee® 200X (Legacy)
Wafer Size: 100mm
Substrate Type: Si
This Washington University report references use of AZ4620 photoresist coated onto the wafer using a Cee® 200X Spin Coater as part of the microfluidics fabrication process.
Publication Year: 2019

Process Overview

This report outlines a basic microfabrication flow for microfluidic device fabrication and includes a spin coating step using AZ4620 photoresist applied to the wafer with a Cee® 200X Spin Coater. The coating step is part of the photolithography sequence used to prepare the wafer for subsequent processing, making this a direct university research reference for Cee® equipment in microfluidics fabrication.

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