This paper develops OSTE-AS polymers for bonding and integration with silicon wafers and explicitly states that the OSTE-AS prepolymers were deposited on silicon wafers using a Cee® Apogee® Spin Coater module of an X-Pro II Workstation. The paper also reports 100 mm silicon wafers and gives resulting film thicknesses of 12.9 µm, 4.9 µm, and 3.4 µm at 1000, 3000, and 5000 rpm, respectively.