Overview

The Cee® Splash Ring is designed for specialized spin coating applications where excess material expelled from the rotating wafer may redeposit onto the substrate surface.

During spin coating, material is driven radially outward as part of normal film formation. In certain operating conditions, such as elevated RPM, larger substrate sizes, or higher dispense volumes, expelled material can rebound within the bowl and return to the wafer. Redeposition may appear as comet-shaped streaks or isolated particulates on the substrate surface.

Key Capabilities

The Splash Ring integrates with the Apogee® spin bowl and directs the movement of excess material as it leaves the rotating wafer.

By managing radial throw-off during spin acceleration and casting, the Splash Ring:

• Reduces defects in high-RPM applications

• Improves surface consistency for larger substrates

• Enhances process stability in high-volume dispense processes

The Splash Ring is intended for customers refining coating recipes where material dynamics become more pronounced. It is not required for standard operation, but provides additional process control in specific applications.

Pair with Cee® Bowl Liners to maximize coating environment control and cleanliness.

Compatibility

The Splash Ring is available for:

• Apogee® 200 Spin Coater

• Apogee® 450 Spin Coater

Compatible with all mounting configurations, including benchtop, flange-mounted, and integrated workstation installations.

Fully compatible with Cee® Bowl Liners.