Enjoy repeatable performance in a compact, semi-automated system. No oversized footprint. No unnecessary complexity. Just the control and flexibility you need without the cost you don’t. Get track-level results, without the track.
Still using “popsicle sticks” and tweezers? DIY debonding puts your wafers and operators at risk. The Apogee® Thermal Slide Debonder uses proven semi-automated technology to separate wafers without breakage. The result? A consistent process, higher yields, and safer handling.
From R&D labs to production lines, the Apogee® Thermal Slide Debonder delivers high throughput with minimal effort. One operator can run multiple systems at once, whether you’re processing 20 wafers a week or 2,000. Add capacity without adding headcount, and scale without reworking your entire operation.
Precision isn’t optional. The Apogee® Thermal Slide Debonder is built for exacting separation with ultra-flat, parallel platens, dual heating, and fine-tuned control of force and speed. Micron-level search and press-force detection safeguard wafers from damage. Every parameter is measured, controlled, and repeatable.
Enjoy repeatable performance in a compact, semi-automated system. No oversized footprint. No unnecessary complexity. Just the control and flexibility you need without the cost you don’t. Get track-level results, without the track.
No hardware swaps, no downtime. Whether it’s 2-inch R&D or 200mm production wafers, scaling is as simple as changing the recipe. Adapt to varying dimensions, thicknesses, and materials with the precision and repeatability your process demands.
Engineered for superior performance, usability, versatility—and peace of mind.
On-board 10-inch color touchscreen with DataStream™ OS included for visibility and your ease-of-use.
Recipe controlled vacuum zones allow processing of multiple wafer sizes, including matched or mismatched diameters, through simple recipe selection.
Uniform, dual-sided heating from independently temperature-controlled platens supports controlled debonding and reduced wafer stress.
Floor standing design fits seamlessly into tight spaces. Integrated storage keeps components organized and within reach.
Multi-color light tower provides real-time visual cues for system states including; boot-up, idle, active process, completion, and error conditions
Fully enclosed system with integrated exhaust removes process fumes and excess heat, supporting a controlled and safe operating environment.
NRTL certification is crucial for semiconductor equipment, ensuring compliance with safety standards set by regulatory bodies like OSHA and ANSI.
Cee® debonders are NRTL listed right out of the box…
…your safety department is going to love you.
Knowledge is power. With DataStream™ technology, monitor and manage in real time, ensuring production-quality results from anywhere. Proactive warnings and detailed log files give you the information you need to succeed.
Process parameters and measurements are logged in real-time. Export in multiple formats for analysis, troubleshooting, and process optimization.
Access your Apogee® Thermal Slide Debonder remotely via any web browser for real-time monitoring, adjustments, and recipe management. Create, modify, upload, download, and archive recipes seamlessly.
200mm Round
50mm Round
1-100N
300°C
0-20 mm/s
10″ Full Color Touchscreen (included)
Unlimited / Unlimited
0.1 s
560 lb (208.7kg)
800 lb (363kg)
W: 38.7″ (983mm)
D: 40.2″ (1022mm)
H: 57″ (1448mm)
W: 48″ (1220mm)
D: 48″ (1220mm)
H: 71″ (1804mm)
208-230 VAC
1/4″ Push to Connect, <20″ Hg (33kPa)
15.3A (max)
1/4″ Push to Connect, 70psi (482kPa)
2″ OD, 0.4″ H2O@10CFM (100Pa@17CMH)
W: 13.25″ (337mm) W
D: 21″ (533mm) D
H: 13.25″ (337mm) H
With four decades of experience, our experts will collaborate closely with you to understand your requirements and deliver solutions that exceed expectations.
