Temporary Wafer Bonding Equipment Suite
Cost Effective Equipment's temporary bonding equipment suite, temporary bonding materials, and process development expertise provide the complete thin wafer handling package for small- to medium-scale production.
Coating & Baking
|Temporary Wafer Bonding/Debonding Tool Suite|
|Total Throughput||Est. 4-14 WPH for wafers ≤ 150-300 mm in diameter*|
|Qualified Wafer Materials||SiC, GaN, GaAs, InP, sapphire, silicon, glass|