Temporary Wafer Bonding Equipment Suite

Cost Effective Equipment's temporary bonding equipment suite, temporary bonding materials, and process development expertise provide the complete thin wafer handling package for small- to medium-scale production.

Coating & Baking
Temporary Wafer Bonding/Debonding Tool Suite
Total ThroughputEst. 4-14 WPH for wafers ≤ 150-300 mm in diameter*
Qualified Wafer MaterialsSiC, GaN, GaAs, InP, sapphire, silicon, glass
Machine Yield>99%
Request More Information