Precision Temporary Wafer Bonder

Apogee™ Bonder

Apogee Bonder

When yield matters.

Related Information




Utilities Diagram(s)


The average semiconductor process takes up to 90 days with hundreds of steps. Temporary bonding fits in near the end; typically for thinning and packaging preparation. Don’t risk wafer yield now! Bond without the worry of yield loss on the Apogee™ Bonder.

The Temporary Bonding & Debonding Process Flow

Cee Apogee Wafer Bond Debond Mount Demount Process Flow


Cee Contact Us

1. let's talk

Speak with our team to learn about your options.

Get a quote

2. Get a quote

Receive a comprehensive proposal.

Cee Install

3. Installation

Cee® engineers provide on-site installation and process training for your team. 

Cee Support Team

4. Run With Confidence

From installation to process guidance, enjoy reliable support from our world class team.

Program. Monitor. Analyze.

Stop wondering what went wrong. DataStream™ monitors and records all processing parameters in real-time. Proactive warnings and detailed log files give you the information you need to succeed.

The Cee® Apogee™ Bonder provides high performance temporary wafer bonding without the hassle, footprint and expense of a track-system.  Offering void free vacuum bonding with Total Thickness Variation (TTV) as low as 2µm, throughputs up to 12 wafers/hour, and precise alignment between the device and carrier wafers; the Apogee Bonder is the preferred choice for small volume manufacturing and laboratory research and development around the world.

DataStream™ technology provides precise control of the bonding process including temperatures, bond forces, and pressure ramp cycles.  Real-time network accessibility and complete logging of every substrate run gives you the information you need to manage your processes and yield.

Designed with flexibility in mind, the Apogee Bonder can adapt with your needs as you manage changing adhesive materials, and wafer and carrier sizes.  Rapid change tooling allows you to swap between wafers sizes in minutes and the dual heated ultra-flat bonding surfaces are self-aligning to maintain TTV control wafer after wafer, day after day.