Cee® equipment has been used in lithography, MEMS, nanofabrication, and advanced materials research across a wide range of institutions and process conditions. This library organizes application references by wafer size, process type, and equipment platform. Specific locations, coating materials, and substrate types can also be filtered.
This preprint describes a glass-based microfluidic bioelectrochemical cell platform for studying extracellular electron uptake in microbes. The fabrication flow explicitly references an Apogee® Spin Coater for coating KL8020 HMDS Spin-On Primer, and the process also includes spin-coated LOR 10B, Microposit™ S1805™, AZ P4620, and SU-8 2100 within the device fabrication sequence.
Cornell NanoScale Facility lists multiple specific Cee® lithography support tools in its open-access cleanroom, including Cee® 1300X hotplates, Cee® Apogee spinners, and a Cee® Flange Spinner Model 200 platform used for edge bead removal.
This doctoral thesis investigates SiC-based memristors for neuromorphic computing. Within the fabrication flow, the photolithography process explicitly includes S1813 positive photoresist, AZ2070 negative resist, silicon wafers, and a Cee™ Apogee Spin Coater and Bake Plate module for the resist spin/bake step.
The KU Nanofabrication Facility provides Cee® spin coating and bake systems as part of its shared cleanroom infrastructure for lithography and thin-film processing.
The AggieFab facility at Texas A&M utilizes a complete Cee® lithography workflow, including spin coating, bake, and develop systems, to support a wide range of thin-film and photolithographic processes in a shared research environment.
This work demonstrates fabrication of flexible near-field electronic biosensors using spin-coated SU-8 and AZ3310 photoresists. The study explicitly references Cee® 200X-F and Apogee® systems for these coating steps.
Sub-1% Coating Uniformity on 300 mm Wafers Sub-1% Coating Uniformity on 300 mm Wafers Using Apogee™ Spin Coater
300 mm
Lithography
Spin Coater
A series of controlled experiments were performed to achieve sub-1% total thickness variation across 300 mm silicon wafers using a Cee® 300X (Apogee™) spin coater platform. Multiple process variables were evaluated, including dispense method (static vs dynamic), ramp-to-spin rates, exhaust control, pre-wet conditions, and spread spin behavior. The results identified exhaust control and ramp-to-spin as the most significant contributors to coating uniformity.