When yield matters, bond your wafers without worry on the Apogee™ Bonder.

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Find answers to commonly asked questions on Cee® spin coating, baking and developing equipment.

Rapidly implement a temporary wafer bonding and debonding process in an integrated solution. Eliminate the confusion. Our team is here to empower you.

Integrated. Easy. Ready-to-Run.
The Cee® X-Pro II Workstation is your one-stop-shop for a fully integrated, semiconductor coat, bake and develop solution.

Reveal the Pattern. Perfectly develop your wafer with unprecedented precision and control on a Cee® Spin Developer, without the investment of a track system.

Bake smarter. Unrivaled bake uniformity edge-to-edge and wafer-to-wafer with the Cee® line of semiconductor bake plates.

Consistent, reliable spin coating results the first time, every time with the Cee® line of high-performance spin coaters.

Cost Effective Equipment has been serving the semiconductor industry since 1987 with high quality, high performance wafer processing equipment.

DataStream™ gives you access to all of your connected Apogee™ wafer processing equipment in one place to remotely track, access, and modify your systems.