Spin Chucks for Square Substrates
Spin-coating is a process used to evenly distribute material on a substrate by spinning it at a high speed. Round substrates are commonly used because their smooth edges create minimal turbulence, resulting in uniform evaporation rates. However, square and rectangular substrates create unique challenges due to increased air turbulence and can result in uneven coating […]
Spin Chucks for Thinned Substrates
Thinner and delicate substrates are commonly used in the semiconductor industry, and their safe handling requires special techniques and spin chucks. These substrates can be made of various materials, including silicon, metal foils, and flexible polymer films, and are highly sensitive to mechanical and thermal shock. Thin Wafer Processing Trends Thin and fragile substrates are […]