CoPro™ Hybrid Workstation

Hybrid workstation for manual processing and automated cassette runs

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Hybrid by design

The freedom of R&D. The power of automation.

Open the sash and work directly with your process when development calls for hands-on access. Refine a recipe, work with a specialty sample, or run individual steps at your own pace.

When the process is ready for repeatable runs, load a cassette and let the integrated cobot handle transfers between process modules. CoPro™ brings manual access and automated handling together for R&D, process development, and low-volume production.

Wafer flexibility

Different sizes. The same workstation.

A changing wafer size should not dictate an entirely different processing platform. CoPro™ accommodates round wafers from 2″ to 200 mm, helping a shared lab support a broader mix of projects.

Keep hands-on access for pieces, smaller substrates, and specialty samples. Match the cassette, chuck, and handling configuration to the wafer sizes in your workflow, then choose manual processing or cassette-based automation to suit the job.

Collaborative automation

Let the cobot connect your process.

Connect coating, baking, and developing steps with automated precision wafer handling. The integrated collaborative robot moves wafers between the configured modules, reducing the operator transfers needed to carry a wafer through the workflow.

Dual cassette positions support batch flexibility. Bring routine runs into an automated sequence while preserving the manual access that makes the same workstation useful for development work.

Apogee® Spin Coater

Controlled coating in the integrated workflow.

Apogee® Bake Plate

Add the thermal steps your process needs.

Apogee® Spin Developer

Develop and clean within the same platform.

Working Surface

Keep space for hands-on process tasks.

DI Sink

Include a dedicated sink in your layout.

Modular

Build your process, your way.

Configure up to four 200 mm Apogee® process modules around the steps your application needs. Combine spin coating, baking, and developing with work-surface or DI-sink options.

Choose the process layout, wafer sizes, material delivery, and enclosure together so manual and automated work fit the same workstation.

Built for the way you work

Process flexibility is only part of the platform. CoPro™ also brings wafer handling, containment, and workspace choices together.

Dual Cassettes

Two cassette positions help you plan batch handling around the work you run.

Exhaust Hood Options

Choose a ducted exhaust enclosure or fan filter unit, with a laminar downflow option.

Chemical Containment

An exhausted sub-cabinet provides secondary chemical containment with leak sensors.

NRTL Certified

Evaluated and certified by a Nationally Recognized Testing Laboratory to applicable UL safety standards.

CoPro™ Hybrid Workstation Specs

Process Modules

Up to four 200 mm modules

Round Wafer Range

2″–200 mm

Operation

Manual and cassette-based automated processing

Dimensions

Machine Weight

1,300 lb (approx. 590 kg)

Shipping Weight

1,500 lb (approx. 680 kg)
Weights vary with installed process modules.

Dimensions

W: 85″ (216 cm)
D: 44″ (112 cm)
H: 82″ (208 cm)

Utilities

Voltage

208–230 VAC, 50/60 Hz, 1 phase

Full Load Current

26.2 A maximum

Nitrogen (N₂)

¼″ push-to-connect, 70 psi (482 kPa)

Vacuum

¼″ push-to-connect or ¼″ FNPT; <20″ Hg (33 kPa)

Hood Exhaust

If equipped with ducted hood: 8″ OD, 0.4″ H₂O, 540 cfm (100 Pa at 917 CMH)

Cabinet Exhaust

4″ OD, 0.4″ H₂O, 20 cfm (100 Pa at 34 CMH)

Individual modules may require additional exhaust and drain connections. Confirm final facility requirements for the selected configuration.

Datasheet