Spin Chucks for Thinned Substrates

Thinner and delicate substrates are commonly used in the semiconductor industry, and their safe handling requires special techniques and spin chucks. These substrates can be made of various materials, including silicon, metal foils, and flexible polymer films, and are highly sensitive to mechanical and thermal shock. Thin Wafer Processing Trends Thin and fragile substrates are […]

SEMICON EUROPA · 10–13 NOVEMBER

Bring your process questions.

Meet Jacob, CEE’s Global Sales Director, in Munich with our partner SiSTEM Technology.

Stand C1353 · Messe München
Spin coating, bake and chill, temporary bonding and debonding.

Book a stand meeting →

Mention Jacob from CEE in SiSTEM’s booking form.