Fundamentals of microfluidics fabrication process and the basic process flow of fabrication
4 inch
Acetone, AZ4620, DI Water, IPA
Spin Coater, 200mm Spin Coater, 200X (Legacy)
Source:Washington University in St. Louis, MEMS 500 Independent Study report by X. Jiang.
Material: Acetone, AZ4620, DI Water, IPA
Source:Si
This Washington University report references use of AZ4620 photoresist coated onto the wafer using a Cee® 200X Spin Coater as part of the microfluidics fabrication process.
Publication Year: 2019
Process Overview
This report outlines a basic microfabrication flow for microfluidic device fabrication and includes a spin coating step using AZ4620 photoresist applied to the wafer with a Cee® 200X Spin Coater. The coating step is part of the photolithography sequence used to prepare the wafer for subsequent processing, making this a direct university research reference for Cee® equipment in microfluidics fabrication.
The University of Miami BioNIUM nanofabrication facility tool listing explicitly includes a Cee® 200X Precision Spin Coater as part of its lithography-related equipment set.
Direct Photopatterning of Metal Oxide Structures Using Photosensitive Metallorganics
4 inch
MIBK
Spin Coater, 200mm Spin Coater, 100 (Legacy)
This Georgia Tech paper describes direct photopatterning of mixed-metal oxide films using a photosensitive metallorganic precursor. The precursor films were spin coated onto 100 mm single-side polished silicon wafers using a Cee® Model 100 CB Spin Coater and Bake Unit
The University of Kansas Nanofabrication Facility lists a Cee® coat and bake workflow that includes a Cee® 200CBX Programmable Spin Coater, Cee® 1300X Hot Plate, and Cee® Apogee® Hot Plate. The page also states that the 200CBX supports multiple chuck sizes for a variety of substrate sizes.
