Direct Photopatterning of Metal Oxide Structures Using Photosensitive Metallorganics
4 inch
MIBK
Spin Coater, 200mm Spin Coater, 100 (Legacy)
Source:Georgia Institute of Technology / Journal of The Electrochemical Society
Material: MIBK
Source:Si
This Georgia Tech paper describes direct photopatterning of mixed-metal oxide films using a photosensitive metallorganic precursor. The precursor films were spin coated onto 100 mm single-side polished silicon wafers using a Cee® Model 100 CB Spin Coater and Bake Unit
Publication Year: 2004
Process Overview
This paper presents a process for depositing and patterning mixed-metal oxide thin films using photosensitive metallorganic precursors for microelectronic applications such as dielectric layers and integrated capacitors. The precursor solution was prepared from Ba(2-ethylhexanoate), Sr(2-ethylhexanoate), and Ti(diisopropoxide) bis(acetylacetonate) in methyl isobutyl ketone, and films were prepared on single-side polished, 100 mm ⟨100⟩ n-type silicon wafers. The paper explicitly states that these films were coated by spin casting using a Cee® Model 100 CB Spin Coater and Bake Unit. It also notes that dielectric test structures were prepared by spin casting the BST precursor solution onto aluminum-coated wafers to produce films approximately 800 nm thick.
The University of Miami BioNIUM nanofabrication facility tool listing explicitly includes a Cee® 200X Precision Spin Coater as part of its lithography-related equipment set.
The University of Kansas Nanofabrication Facility lists a Cee® coat and bake workflow that includes a Cee® 200CBX Programmable Spin Coater, Cee® 1300X Hot Plate, and Cee® Apogee® Hot Plate. The page also states that the 200CBX supports multiple chuck sizes for a variety of substrate sizes.
The University of Michigan Lurie Nanofabrication Facility equipment directory lists multiple Cee® lithography tools, including coating, developing, and Apogee® spin coating platforms within the facility’s lithography area.
