Off-Stoichiometry Thiol–Ene Polymers: Inclusion of Anchor Groups Using Allylsilanes

Spin Coater
Bio, Microfluidics
Materials: OSTE-AS Polymer

Polymers (MDPI)

Apogee® 200 Spin Coater

Wafer Size: 100mm

Substrate Type: Si

This paper develops OSTE-AS polymers for bonding and integration with silicon wafers and explicitly states that the OSTE-AS prepolymers were deposited on silicon wafers using a Cee® Apogee® Spin Coater module of an X-Pro II Workstation. The paper also reports 100 mm silicon wafers and gives resulting film thicknesses of 12.9 µm, 4.9 µm, and 3.4 µm at 1000, 3000, and 5000 rpm, respectively.

Publication Year: 2023

Process Overview

This article focuses on silane-containing off-stoichiometry thiol–ene polymers designed for integration with silicon wafers in microelectronic, biomedical, and microfluidic applications. The OSTE-AS formulation is based on TATATO, PETMA, allyltrimethoxysilane, and TPO-L, and the paper states that the prepolymer was bonded to silicon surfaces with natural oxide using 110 °C heat for 15 minutes with about 0.5 MPa pressure. For the coating step, the paper explicitly states that deposition of the OSTE-AS prepolymers on silicon wafers via centrifugation was carried out using an Apogee spin-coater module of an X-Pro II workstation (CEE, Saint James, MO, USA) at various rotation speeds. It further reports that, when using 100 mm silicon wafers, the OSTE-AS polymer film thicknesses were 12.9 µm at 1000 rpm, 4.9 µm at 3000 rpm, and 3.4 µm at 5000 rpm. That makes this a solid reference for Cee® Apogee® use in polymer coating and silicon wafer integration.

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