The Apogee® Mechanical Debonder is the newest generation debonder for small volume production, and research and development applications.  Coupled with appropriate bonding adhesive materials, the process works by holding the device wafer on a film frame against a flat surface and gently peeling the carrier away with precisely controlled forces.

Advantages include minimized stresses on the device wafer, high throughput, and room temperature operation allowing the use of very high-temperature adhesives for post-bond processing.  Unlike solvent debond processes, there are no messy solvents and the device wafer remains attached to the film frame throughout the process so no more lost devices.

The debond process is fully programmable and automated leaving operator interaction limited to simply loading bonded pairs and unloading the de-bonded device and carrier wafers.  As with other Cee® tools, the Apogee® Mechanical Debonder provides the performance of a track system without the hassle, footprint, and cost.  DataStream™ technology provides real-time network access, remote monitoring, and logging of all critical parameters.