Overview

The Cee® Spin Bowl Purge system creates a controlled, low-oxygen, low-humidity atmosphere. By introducing an inert gas (typically nitrogen) directly into the spin environment, the system reduces oxygen and water vapor concentration to reduce unwanted effects on sensitive materials.

In spin coating applications where materials are prone to oxidative reactions prior to curing, controlling the atmosphere inside the bowl becomes critical. The Spin Bowl Purge system enables more stable processing conditions for polyimides, specialty resists, and other oxygen-sensitive chemistries, improving film quality, material behavior, and overall process repeatability.

Key Capabilities

The Spin Bowl Purge system delivers inert gas directly into the spin chamber, displacing ambient air during coating steps. The controlled atmosphere is especially beneficial when processing materials that may chemically shift before bake or cure.

Two configuration options are available:

Manual Configuration
A simple manual valve allows operators to turn purge gas on or off, providing straightforward control without recipe integration.

Automated Configuration
Purge operation is integrated into the DataStream™ software and can be defined within individual recipe steps. Purge timing and duration are precisely controlled during the coating process, ensuring inert conditions while maintaining full process repeatability. 

Combine with the OptiFlow™ Exhaust Control System for maximum stability and control of your internal bowl atmosphere.

Compatibility

The Spin Bowl Purge system is available for:

• Apogee® 200 Spin Coater (Manual or Automated)

• Apogee® 450 Spin Coater (Manual or Automated)

Available for all mounting configurations, including benchtop, flange-mounted, and integrated workstation installations.