Film Frame Spin Chucks are designed for substrates taped to film frames. Mechanical clamps, vacuum O-rings, and a porous insert combine frame retention with backside support for spin processing.
Each film frame chuck is custom made for your substrate and film-frame specifications and process requirements.
SKU unavailable — custom made to order.
A taped substrate and its film frame need a holder designed for both parts of the assembly. Film Frame Spin Chucks combine retention of the outer frame with porous backside support for the taped substrate during spin coating and cleaning.
Mechanical clamps and vacuum O-rings secure the frame. The porous insert distributes vacuum beneath the taped surface and supports the substrate, helping limit deflection in fragile materials. The support and retaining features work together to hold the complete assembly.
Frame dimensions, substrate dimensions and tape details determine the chuck configuration. The retaining features locate the specified frame when correctly loaded. The chuck is made for the assembly and its process requirements, rather than serving as a universal holder for every frame size.
Provide the frame drawing, outside dimensions, substrate dimensions and thickness, film or tape details, and Cee tool model. Include the process chemistry, intended spin conditions and permitted contact areas.
The support insert is porous ceramic. Chuck-body material options include Delrin®, PVDF, PTFE, stainless steel, PEEK and anodized aluminum. Confirm chemical compatibility, frame fit and spindle interface for the intended process.
Use the supplied procedure to place the frame, position the clamps and secure any thumbscrews. Engage the retaining features as specified before processing, then release them as directed for removal. Keep the matched porous insert, chuck and frame together; insert handling and cleaning depend on the supplied design.
Substrates taped to film frames
Mechanical clamps and vacuum O-rings
Porous ceramic insert for backside support
Vacuum and mechanical frame retention
Confirm spindle and chuck compatibility
Depend on the frame, substrate, and chuck
SEMICON EUROPA · 10–13 NOVEMBER
Meet Jacob, CEE’s Global Sales Director, in Munich with our partner SiSTEM Technology.
Stand C1353 · Messe München
Spin coating, bake and chill, temporary bonding and debonding.
Mention Jacob from CEE in SiSTEM’s booking form.
