Porous Spin Chucks support thin wafers, films, and foils with a porous insert inside a substrate-matched chuck. Distributed vacuum and backside support make them an option for delicate substrates that need more support than a conventional circular vacuum chuck.
Each porous chuck is custom made for your substrate dimensions and process requirements.
SKU unavailable — custom made to order.
A porous chuck combines a substrate-matched recessed cavity with a porous ceramic insert. The insert spreads vacuum across the supported area and provides broad backside support, helping reduce deflection in thin wafers, flexible films and metal foils.
Thin and flexible materials can bow or distort when held over a small vacuum contact area. Supporting the substrate across the porous surface helps maintain its shape during spin processing. Substrate thickness, flexibility, geometry and backside-contact requirements are evaluated together to define the support arrangement.
The cavity and insert footprint are made for the specified piece. The substrate must cover the entire porous surface to maintain the intended vacuum holding arrangement. For circular applications that require additional positioning assistance, a matched centering device can be considered.
Provide substrate shape, width or diameter, length, thickness, material and a drawing when available. Describe flexibility, backside-contact restrictions, chemistry, intended spin conditions and the Cee tool to be used.
The support insert is porous ceramic. Chuck-body material options include Delrin®, PVDF, PTFE, stainless steel, PEEK and anodized aluminum. Match the body material, porous support and tool interface to the process chemistry and contact requirements.
Use the insert and chuck specified for the substrate. Insert removal varies by design, including push-pin, slot-access and permanent-insert arrangements. Use the supplied procedure, keep the support surface clean and inspect it as part of routine tool checks.
Thin wafers, films, and foils
Porous ceramic insert in a recessed cavity
Across the porous support surface
Vacuum through the porous insert
Entire porous surface covered by the substrate
Depend on substrate and chuck configuration
