Developer Configurations
The use of immersion tank processes in photolithography has decreased due to excessive material consumption, non-uniform resolution, and poor clearing from high-aspect-ratio features. Spin developing has become the more popular method for development of features in photolithography, with three main methods emerging: puddle/stream dispense, side spray dispense, and direct spray dispense. The side spray dispense […]
Multi-Stage Baking with Programmable Lift Pins
Smart-Pin technology enables flexible temperature ramping and uniform baking for thermal shock sensitive materials. The lift pin height recipe utilizes a temperature matrix for soft bake, PEB, and post-develop hard bake. The programmable system eliminates the need for multiple bake plates and is suitable for thick-film materials and mitigating the “skin” effect. Multi-Stage Baking with […]
Spin Chucks for Square Substrates
Spin-coating is a process used to evenly distribute material on a substrate by spinning it at a high speed. Round substrates are commonly used because their smooth edges create minimal turbulence, resulting in uniform evaporation rates. However, square and rectangular substrates create unique challenges due to increased air turbulence and can result in uneven coating […]
Spin Chucks for Thinned Substrates
Thinner and delicate substrates are commonly used in the semiconductor industry, and their safe handling requires special techniques and spin chucks. These substrates can be made of various materials, including silicon, metal foils, and flexible polymer films, and are highly sensitive to mechanical and thermal shock. Thin Wafer Processing Trends Thin and fragile substrates are […]
Selecting Maximum Spin Speed and Acceleration
In spin coating, the speed and acceleration of a spinning substrate affect the thickness and quality of a film. The substrate’s rotational speed affects the centrifugal force and air turbulence, while its acceleration affects the film’s properties. The initial spin cycle is critical because the resin dries quickly, and up to 50% of base solvents […]
Programmable Exhaust for Optimal Thick-Film Spin Coating
For ultra-high uniformity on thick films in spin-coating processes, precise control of solvent vapors is crucial. This is achieved through a closed bowl environment and a programmable exhaust module. The process involves a prewet dispense step, dynamic dispense step, and drying step to create a highly uniform coating. Spin speed, acceleration, and drying rate are […]
Spin Coat Theory
Spin coating is a process used to apply thin films onto a substrate, typically involving depositing a small puddle of a fluid material on the center of the substrate and spinning it at high speed. The final thickness of the film depends on the properties of the fluid and the spin process parameters. The speed […]
Edge Bead Removal and Backside Rinse Demystified
Edge bead removal is used to eliminate build up while backside rinse prevents contamination. Using an automated system for both processes results in precise, efficient, and consistent results with minimal operator intervention. Introduction Edge bead removal (EBR) and back-side rinse (BSR) are critical processes in the fabrication of high-quality micro and nanoscale devices such as […]