Overview

The Cee® Inert Gas Purge introduces a controlled inert atmosphere during thermal processing on Apogee® Bake Plate. Displacement of ambient air with an inert gas, typically nitrogen, reduces oxygen and moisture exposure; supporting more stable material behavior and improving process consistency.

In applications where materials are sensitive to oxidation or environmental variability during heating, controlling the local atmosphere becomes critical. The Inert Gas Purge enables repeatable thermal conditions, improving film quality and process stability for advanced materials.

Key Capabilities

• Localized inert atmosphere reduces oxygen and humidity during the bake process
• Improved film stability for oxidation-sensitive materials
• Consistent gas delivery supports repeatable bake conditions across recipes
• Compatible with a wide range of materials, including polyimides, specialty resists, and advanced coatings

Safety & Facilities

Limit undesirable reactions during thermal processing. Users should ensure gas purity and flow rates are appropriate for the application and follow all facility guidelines for inert gas handling and ventilation.

The Inert Gas Purge requires a regulated inert gas supply and integrates directly with the bake plate. Keep facility exhaust suitable for process fumes. Nitrogen and other inert gases can displace oxygen; follow facility ventilation and compressed-gas procedures. Measure oxygen concentration when the process depends on a low-oxygen atmosphere. Approximately 30 psi and 5 L/min are starting values for evaluation, not a guarantee of 100 ppm oxygen.

Compatibility

The Cee® Inert Gas Purge is available for all Apogee® mounting configurations, including benchtop, flange-mount, and integrated workstation installations. 

• Apogee® 200 Bake Plate

• Apogee® 300 Bake Plate