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The Vacuum Pump provides a dedicated vacuum source for Apogee® Bake Plates when facility vacuum is unavailable or insufficient, supporting vacuum hold-down during hard-contact bakes.
Key performance characteristics include:
Oil-free diaphragm design eliminates contamination risks associated with oil-based vacuum systems
Chemically resistant PTFE-coated internal components provide a PTFE-coated diaphragm and pump head; suitability should be checked for the specific process conditions
Cleanroom-compatible operation suitable for semiconductor research, university laboratories, and advanced materials processing
Quiet operation (~50 dB) minimizes disruption in laboratory environments
Compact footprint allows convenient placement near the equipment or within workstation enclosures
The dedicated vacuum source supports substrate hold-down on a bake plate configured for hard-contact baking. Confirm adequate vacuum at the host tool before processing.
Because the vacuum source is dedicated to the equipment, performance remains consistent regardless of other vacuum users within the facility.
The oil-free design eliminates the need for vacuum oil maintenance and reduces the risk of chemical contamination in cleanroom environments. Integrated thermal protection safeguards the pump against overheating, interrupting operation if the pump overheats. Some configurations may restart after cooling; repeated shutdown requires inspection before reuse.
Maintain at least 3 in (76 mm) of clearance on all sides of the pump for adequate ventilation and cooling. Place the pump in a well-ventilated area; do not enclose it in a sealed cabinet or obstruct ventilation openings.
The Vacuum Pump is available for:
16.7 kPa abs (25 inHg)
20 L/min
~50 dB
8 lb (3.63 kg)
W: 5.5 in (140 mm)
D: 9 in (229 mm)
H: 8 in (203 mm)
110–120 or 208–230 VAC
0.7 A (115 V) / 0.3 A (230 V) max
¼ in OD tube
SEMICON EUROPA · 10–13 NOVEMBER
Meet Jacob, CEE’s Global Sales Director, in Munich with our partner SiSTEM Technology.
Stand C1353 · Messe München
Spin coating, bake and chill, temporary bonding and debonding.
Mention Jacob from CEE in SiSTEM’s booking form.