Overview

Cee® Tipped Plastic Lift Pins provide a softer contact surface for substrate handling on Apogee® Bake Plates. Designed for applications involving fragile or sensitive materials, they reduce contact stress during loading, unloading, and processing while maintaining reliable wafer support.

Key Capabilities

Plastic Tipped Lift Pins replace standard lift pins with compliant tip materials to reduce contact stress at the substrate interface.

Key capabilities include:

• Enhanced substrate protection for fragile, thin, or sensitive materials
• Reduced risk of scratching or surface marking during wafer handling
• Low-friction contact surfaces support smooth loading and unloading
• Available in multiple material options to match thermal requirements and process conditions

Two material configurations are available:

• PTFE (Teflon™) Tipped Lift Pins – Maximum operating temperature of 200 °C
• Vespel® Tipped Lift Pins – Maximum operating temperature of 300 °C

These options allow users to balance substrate protection with thermal process requirements.

Plastic Tipped Lift Pins are typically used in specialized applications where substrate sensitivity is critical. Standard lift pins remain suitable for most silicon and general-purpose applications.

Safety & Facilities

Plastic Tipped Lift Pins introduce temperature limitations based on material selection. Users must ensure that bake temperatures do not exceed the rated limits of the installed lift pin material to prevent degradation or damage.

Care should be taken during substrate loading to place wafers vertically onto the pins. Lateral movement or sliding contact can damage the pin tips and reduce performance over time.

No additional facility requirements are needed beyond standard bake plate operation.

Compatibility

The Cee® Plastic Tipped Lift Pins are available for all Apogee® mounting configurations, including benchtop, flange-mount, and integrated workstation installations. 

• Apogee® 200 Bake Plate

• Apogee® 300 Bake Plate