Centering Devices

Handheld Centering Devices help position a circular wafer on its spin chuck before processing. Each fixture is matched to both the wafer diameter and the physical chuck diameter, giving operators a repeatable reference for placement.

  • Matched to both wafer and chuck diameter
  • Positive contact with the outside of the spin chuck
  • Standard sizes from 2 inch through 300 mm
  • Custom configurations available for discussion
  • Removed from the spin bowl before the process begins
Select an option to see the SKU.

Need the matching chuck or a chuck set?

Product Information

A Repeatable Placement Reference

A handheld centering device mates to the outside of a circular chuck and guides the wafer into position before processing. The fixture gives operators a repeatable reference for placement and is removed before the spin program begins.

Placement Before Processing

Engage the fixture with the outside radius of the chuck, place the wafer on the chuck and gently bring its edge against the device’s reference surface. Turn on vacuum and confirm substrate-present status. Move the device away from the wafer and completely out of the spin bowl before closing the lid and starting the recipe.

Routine Care

Inspect the device for residue, damage or loose parts before daily use. Keep its contact surfaces clean to reduce the risk of wafer contamination, and follow the Centering Device Manual for cleaning and handling guidance.

When a Separate Fixture Is Useful

These devices support wafer placement on circular chucks. Recessed and captive chucks locate their specified substrates using a recess or arms and normally do not need a separate handheld fixture.

Match the Wafer and Chuck

Choose both the wafer diameter and the physical chuck diameter. A 200 mm wafer has separate devices for 4″ and 6.188″ chucks, so check the chuck fitted to your tool before selecting a SKU. Refer to the Chuck Sizing Chart when selecting the chuck itself.

Handheld Centering Device Options

Wafer diameter
Chuck diameter
SKU
3″
2.25″
902835
100 mm
2.25″
902681
150 mm
4″
902682
200 mm
4″
902691
200 mm
6.188″
902858
300 mm
6.188″
902859

The manual also lists 2″ and 125 mm wafer configurations. Contact Cee for these or other custom requirements.

Confirm Your Configuration

Provide the selected SKU, wafer diameter, physical chuck diameter and Cee tool model when requesting a quote. Include any special substrate or handling requirements. For individual chucks and chuck sets, visit Circular Spin Chucks.

Material

Delrin

Location Reference

Outside radius of the matching chuck

Utilities & Tool Fit

Vacuum

Supplied by the tool and spin chuck

During Processing

Device removed from the spin bowl

Tool Fit

Confirm wafer, chuck and Cee tool

Centering Device Videos
Find the right chuck for your substrate.