Temporary bonding and debonding process to prevent deformation of metal connection in thermocompression bonding

How Cee® equipment is used

Example 5 names an Apogee® Bonder for joining device wafers to 4-inch glass carriers coated with BrewerBOND® material. Following cure, the stack was returned to the bonder for a thermocompression simulation using a 300 °C upper platen, 100 °C lower platen and 1650 N for 15 seconds. These are reported experimental conditions in US12381170B2. The example does not identify the equipment used for the later debond step.

Equipment reported

Apogee® Bonder

Source type

Patent

Publication year

2025

Materials

BrewerBond, Temporary Bonding Adhesive

Substrate

Glass

Source

Brewer Science — Published Patent Examples

Process context

This entry describes a patent example. Consult the original document for the experimental procedure and the scope of its claims. Materials recorded for this reference include BrewerBond, Temporary Bonding Adhesive.