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PatentCee 200FX; Brewer Science peel debonder2018
Brewer Science — Published Patent Examples
The patent reports cleaning of temporary-bonding adhesive after wafer debonding.
Advanced PackagingTemporary Bonding & DebondingCyclic olefin polymer
Citation & equipment evidence
Source reference
Brewer Science — Published Patent Examples. 2018. Cyclic olefin polymer compositions and polysiloxane release layers for use in temporary wafer bonding processes
Equipment evidence
Brewer Science's patent examples identify a Cee® 200FX for cleaning adhesive residues after temporary-wafer release. The examples also name a Brewer Science peel debonder, without establishing an Apogee® debonder model.
Paper / reportCee® 1300CSX2013
TriQuint and Brewer Science, CS MANTECH
TriQuint and Brewer Science report Cee® 1300CSX slide debonding for backside processing of thin device wafers with high surface topography.
Advanced PackagingTemporary Bonding & DebondingTemporary Bonding Adhesive
Citation & equipment evidence
Source reference
TriQuint and Brewer Science, CS MANTECH. 2013. Meeting the Fabrication Challenges for Backside Processing on Thin Substrates with Ultrahigh Device Topography
Equipment evidence
TriQuint reports installing a Cee® 1300CSX in early 2013 and using heated chucks at 190°C for slide-off debonding of thinned device wafers. This is a jointly authored TriQuint and Brewer Science paper.
Paper / reportCee® 1300DB2014
NCAP and Chinese Academy of Sciences, ICEPT
NCAP and Chinese Academy of Sciences researchers use a Cee® 1300DB for thermal-slide debonding in a TSV process with copper pillar bumps.
Advanced PackagingTemporary Bonding & DebondingTemporary Bonding Adhesive
Citation & equipment evidence
Source reference
Jing X, Jiang F, Xu C, Xue K, Dai F, Li Z, Zhang W. 2014. Investigation of temporary bonding and release processes for TSV with copper pillar bumps. 15th International Conference on Electronic Packaging Technology. pp. 86–89. DOI: 10.1109/ICEPT.2014.6922602.
Equipment evidence
A Cee® 1300DB performs thermal-slide release. Bonding is assigned to a separate EVG 520 in the reported process; the Cee® instrument is not described as the bonder.
Source location: Thermal-slide debonding experiment, Cee 1300DB equipment mention.
Facility / company referenceApogee® Bonder & De-Bonder (source wording)2026
Kayaku Advanced Materials
Kayaku Advanced Materials documents in-house Apogee® bonding and debonding capabilities for advanced packaging and wafer-level fabrication.
Advanced PackagingTemporary Bonding & Debonding
Citation & equipment evidence
Source reference
Kayaku Advanced Materials. 2026. Design Fabrication Services: Semiconductor & Wafer Processing Capabilities. Published August 31, 2026.
Equipment evidence
This is a company capability reference. It does not establish a named customer result, a specific adhesive recipe, or the exact debonder model.
Source location: Temporary bonding/debonding capability and equipment descriptions.
Paper / reportCee® 1300CSX2014
TriQuint and Brewer Science, CS MANTECH
TriQuint and Brewer Science report Cee® 1300CSX thermal-slide debonding as part of improvements to thin-wafer handling and support.
Advanced PackagingTemporary Bonding & DebondingTemporary Bonding Adhesive
Citation & equipment evidence
Source reference
TriQuint and Brewer Science, CS MANTECH. 2014. Improvements in Thin Wafer Handling – Equipment and Material Impacts
Equipment evidence
The experimental tool list names the Cee® 1300CSX slide debonder. The paper compares temporary-bonding materials and describes support of the released wafer through transfer to tape mounting. This is a jointly authored customer and supplier study, separate from the team's 2013 fabrication paper.
Paper / reportCee® equipment; model not reported2021
Brewer Science — iMAPS Device Packaging Conference
Brewer Science demonstrated mechanical release of a low-Tg temporary bonding material using an in-house Cee® mechanical debonder. The presentation investigates temporary support materials for wafer-level system-in-package and fan-out wafer-level packaging.
Advanced PackagingTemporary Bonding & DebondingTemporary Bonding Adhesive
Citation & equipment evidence
Source reference
Brewer Science — iMAPS Device Packaging Conference. 2021. A Low Tg Bonding Material for use with Wafer-Level System-in-Package (WLSiP) and Fan-Out Wafer Level Packaging (FOWLP) Processes
Equipment evidence
Slide 18 explicitly identifies the Cee® mechanical debonder for Material A. The presentation also contains thermal-slide and laser-release investigations, but those steps are not attributed to the Cee® tool. Material A is an experimental bonding material; no Cee® model number or wafer diameter is identified for the mechanical-debond test. Source: Arthur Southard, iMAPS Device Packaging Conference, April 13, 2021.
Other referenceApogee® Mechanical Debonder2017
Journal of Microelectronics and Electronic Packaging, Vol. 14, Issue 1
This paper evaluates temporary wafer bonding materials for semiconductor processing and shows compatibility with both mechanical and laser debonding approaches. In the mechanical release flow, bonded wafer pairs were separated using a Cee® Apogee® Mechanical Debonder.
Temporary Bonding & DebondingBrewerBond
Citation & equipment evidence
Source reference
Liu X, Wu Q, Bai D, Stanley T, Lee A, Su J, Huang B. 2017. Temporary Wafer Bonding Materials with Mechanical and Laser Debonding Technologies for Semiconductor Device Processing. Journal of Microelectronics and Electronic Packaging. 14:39–43.
Equipment evidence
The paper explicitly identifies an Apogee® Mechanical Debonder for mechanically separating bonded wafer pairs. The laser-release process is a separate route, rather than a function attributed to this instrument.
Source location: Mechanical debonding process description.
