Paper / report
Thermal-slide release of TSV wafers with copper pillarsCee® 1300DB
Kayaku Advanced Materials describes its in-house wafer-processing capabilities, including Apogee® bonding and debonding equipment.
This is a company capability reference. It does not establish a named customer result, a specific adhesive recipe, or the exact debonder model.
Kayaku identifies in-house Apogee® bonding and debonding equipment for wafers up to 200 mm. This is a company fabrication-capability reference, not a named customer case study; the exact debonder model and bonding chemistry are not specified.
Kayaku Advanced Materials. 2026. Design Fabrication Services: Semiconductor & Wafer Processing Capabilities. Published August 31, 2026.
Equipment reference: Temporary bonding/debonding capability and equipment descriptions.
Open original source ↗Application summary prepared by Cee. The original source remains the authority for its methods and findings.
SEMICON EUROPA · 10–13 NOVEMBER
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Stand C1353 · Messe München
Spin coating, bake and chill, temporary bonding and debonding.
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