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Facility / company referenceApogee® Bonder & De-Bonder (source wording)2026
Kayaku Advanced Materials
Kayaku Advanced Materials documents in-house Apogee® bonding and debonding capabilities for advanced packaging and wafer-level fabrication.
Advanced PackagingTemporary Bonding & Debonding
Citation & equipment evidence
Source reference
Kayaku Advanced Materials. 2026. Design Fabrication Services: Semiconductor & Wafer Processing Capabilities. Published August 31, 2026.
Equipment evidence
This is a company capability reference. It does not establish a named customer result, a specific adhesive recipe, or the exact debonder model.
Source location: Temporary bonding/debonding capability and equipment descriptions.
PatentApogee® Bonder2019
Brewer Science — Published Patent Examples
A Cee® Apogee® Bonder was used to assemble glass-wafer pairs with a laminated, laser-releasable temporary bonding film in Brewer Science's published 3-D IC materials examples.
Advanced PackagingTemporary Bonding & DebondingTemporary Bonding Adhesive
Citation & equipment evidence
Source reference
Brewer Science — Published Patent Examples. 2019. Laser-releasable bonding materials for 3-D IC applications
Equipment evidence
Example 11 bonds two 100 mm glass wafers using the Cee® Apogee® Bonder at a platen temperature of 230 °C and 1800 N for 3 minutes. The film was prepared and laminated in the preceding examples. Example 12 performs subsequent laser separation on a Kingyoup laser debonder. The Cee® equipment attribution here is the bonding step. Source: US20190194453A1, published June 27, 2019; the later grant is the same patent family.
PatentApogee® Bonder2025
Brewer Science — Published Patent Examples
Brewer Science's published patent examples use a Cee® Apogee® Bonder to evaluate temporary wafer support during thermocompression processing of copper pillars with solder caps. Cee® spin coating is also identified for protective and carrier-bonding layers.
Advanced PackagingTemporary Bonding & DebondingBrewerBondTemporary Bonding Adhesive
Citation & equipment evidence
Source reference
Brewer Science — Published Patent Examples. 2025. Temporary bonding and debonding process to prevent deformation of metal connection in thermocompression bonding
Equipment evidence
Example 5 names an Apogee® Bonder for joining device wafers to 4-inch glass carriers coated with BrewerBOND® material. Following cure, the stack was returned to the bonder for a thermocompression simulation using a 300 °C upper platen, 100 °C lower platen and 1650 N for 15 seconds. These are reported experimental conditions in US12381170B2. The example does not identify the equipment used for the later debond step.
