Laser-releasable bonding materials for 3-D IC applications

How Cee® equipment is used

Example 11 bonds two 100 mm glass wafers using the Cee® Apogee® Bonder at a platen temperature of 230 °C and 1800 N for 3 minutes. The film was prepared and laminated in the preceding examples. Example 12 performs subsequent laser separation on a Kingyoup laser debonder. The Cee® equipment attribution here is the bonding step. Source: US20190194453A1, published June 27, 2019; the later grant is the same patent family.

Equipment reported

Apogee® Bonder

Source type

Patent

Publication year

2019

Materials

Temporary Bonding Adhesive

Substrate

Glass

Source

Brewer Science — Published Patent Examples

Process context

This entry describes a patent example. Consult the original document for the experimental procedure and the scope of its claims. Materials recorded for this reference include Temporary Bonding Adhesive.