Facility / company reference
In-house wafer bonding and debonding at KayakuApogee® Bonder & De-Bonder (source wording)
NCAP and Chinese Academy of Sciences researchers investigated temporary support and release for TSV wafers with copper-pillar topography.
A Cee® 1300DB performs thermal-slide release. Bonding is assigned to a separate EVG 520 in the reported process; the Cee® instrument is not described as the bonder.
The NCAP/CAS conference study reports thermal-slide release on a Cee® 1300DB at 190°C after processing 8-inch silicon wafers. Bonding uses a separate EVG 520. The authors have NCAP/CAS affiliations; Brewer WaferBOND chemistry remains part of the reported process.
Jing X, Jiang F, Xu C, Xue K, Dai F, Li Z, Zhang W. 2014. Investigation of temporary bonding and release processes for TSV with copper pillar bumps. 15th International Conference on Electronic Packaging Technology. pp. 86–89. DOI: 10.1109/ICEPT.2014.6922602.
Equipment reference: Thermal-slide debonding experiment, Cee 1300DB equipment mention.
Open original source ↗Application summary prepared by Cee. The original source remains the authority for its methods and findings.
SEMICON EUROPA · 10–13 NOVEMBER
Meet Jacob, CEE’s Global Sales Director, in Munich with our partner SiSTEM Technology.
Stand C1353 · Messe München
Spin coating, bake and chill, temporary bonding and debonding.
Mention Jacob from CEE in SiSTEM’s booking form.